Parker Chomerics has introduced THERM-A-GAP PAD 120LOE, a thermal gap filler pad offering 12.0 watts per meter-kelvin (W/m-K) thermal conductivity with low silicone oil bleed and migration. The material is designed for long-term thermal management in high-performance electronics, including automotive modules and other applications.
The low-oil-bleed formulation is intended to minimize silicone oil migration, which can create manufacturing and reliability concerns in sensitive electronic assemblies. The pad also provides electrical insulation and vibration dampening while maintaining thermal contact between components and adjacent surfaces.
With a Shore 00 hardness of 45, PAD 120LOE is designed to conform to uneven surfaces and gaps while applying minimal stress to electronic components. Its stress-relaxation characteristics help reduce compression force over time.
Features include:
- Thermal conductivity of 12.0 W/m-K.
- Very low silicone oil bleed and migration.
- Low compression force following stress relaxation.
- High-tack surface to reduce thermal contact resistance.
- Electrical insulation and vibration dampening.
- UL 94 V-0 flammability rating.
PAD 120LOE is available in sheets or custom die-cut sizes, with standard thicknesses ranging from 1 to 5 millimeters (mm).
The material’s thermal and electrical properties may also be relevant to electric vehicle (EV) electronic modules, although Parker has not identified specific EV applications in the announcement.
Filed Under: Power Electronics, Technology News, Thermal Management