
Today on EV Engineering
8-inch SiC process advances for EV power electronics
DB HiTek has completed reliability qualification for its 1,200-V silicon carbide (SiC) MOSFET process on 8-inch (200-mm) wafers. The company is preparing the process for volume production in 2027, with electric vehicles (EVs) among the intended high-voltage applications. SiC power semiconductors can operate efficiently under high-voltage and high-temperature conditions, making the technology suited to EV…New battery laboratory advances LFP material testing
LANXESS has opened a battery laboratory at its Krefeld-Uerdingen site in Germany to test and develop materials for lithium iron phosphate (LFP) batteries. The facility will focus on iron oxide and iron phosphate grades used in LFP cathode materials for electric vehicles and other battery applications. The laboratory allows LANXESS to evaluate material properties directly…Connector-based controller extends dc charging distance to 100 meters
Vector has introduced vSECC.InPlug, a communication controller board for dc charging infrastructure that enables cable runs of up to 100 meters between the vehicle and charging station. The system is intended for electric bus and truck depots where charging points may need to be separated from centrally located power electronics. Conventional dc charging architectures typically…US public EV charging power rises 47% as network adds 31,600 charge points
The HERE-SBD EV Index 2026 finds that US drivers are becoming more confident in electric vehicle (EV) charging infrastructure even as EV adoption growth slows. America added 31,600 public charge points over the past year, representing 13% of the country’s total public charging network. Total available charging power increased 47%, from 14.1 GW to 20.7…ML-based arc fault detection targets EV charging systems
Asahi Kasei Microdevices (AKM) says its CZ39 and CZ3K series coreless current sensors have been adopted in Microchip Technology’s machine-learning-based arc fault detection reference design built around the dsPIC33A digital signal controller. The design is applicable to electric vehicle (EV) charging infrastructure, as well as other power applications. Arc faults can be difficult to distinguish…FAQs See More >
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8-inch SiC process advances for EV power electronics
DB HiTek has completed reliability qualification for its 1,200-V silicon carbide (SiC) MOSFET process on 8-inch (200-mm) wafers. The company is preparing the process for volume production in 2027, with electric vehicles (EVs) among the intended high-voltage applications. SiC power semiconductors can operate efficiently under high-voltage and high-temperature conditions, making the technology suited to EV…
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8-inch SiC process advances for EV power electronics
DB HiTek has completed reliability qualification for its 1,200-V silicon carbide (SiC) MOSFET process on 8-inch (200-mm) wafers. The company is preparing the process for volume production in 2027, with electric vehicles (EVs) among the intended high-voltage applications. SiC power semiconductors can operate efficiently under high-voltage and high-temperature conditions, making the technology suited to EV…













































