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New SiC-based inverter subassembly targets 800V+ EV architectures

By Michelle Froese | September 4, 2025

ROHM Semiconductor and Schaeffler have begun mass production of a new high-voltage inverter brick equipped with ROHM’s silicon-carbide (SiC) MOSFET bare chips. The subassembly is designed as a key power electronics building block for electric vehicle (EV) drive inverters, and initial deployment is planned by a major Chinese automaker.

The inverter brick generates the high-frequency current pulses that drive an EV’s motor, while managing battery voltages beyond the typical 800-V level and RMS currents up to 650 A.

This compact sub-module integrates the power module for pulse-width modulation (PWM), a dc link capacitor, dc link, and cooling system. A notable feature is the integrated dc boost function, which allows vehicles with 800-V architectures to maintain fast charging rates even when connected to 400-V charging stations.

The modular, scalable design supports integration into a variety of inverter platforms, including X-in-1 e-axle architectures that combine motor, inverter, and transmission.

Production follows a long-term supply agreement that secures capacity for ROHM’s SiC devices, reflecting the increasing demand for efficient high-voltage semiconductors in EV applications.

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Filed Under: Inverter, Technology News
Tagged With: rohmsemiconductor, schaeffler
 

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