Magnachip Semiconductor Corporation announced the release of a new 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package.
The TOLT-packaged MOSFET delivers a significant advancement in thermal management. Unlike conventional TOLL (TO-Leadless) packages that dissipate heat through the bottom, the TOLT package is engineered to release heat directly from the top via a mounted metal heat sink.
This innovative structure substantially reduces thermal resistance between the junction and the external environment, making it well-suited for thermally demanding applications, such as e-scooters and light electric vehicles (LEVs).
Simulations and tests conducted by Magnachip demonstrated that our new 80V MV TOLT package solution achieved an average 22% reduction in junction temperature compared to using standard TOLT packages. This improvement not only extends an application’s lifespan but also enhances the system’s reliability.
Additionally, the TOLT package enables compact and lightweight application designs, thanks to its high power density and efficient thermal flow, which does not compromise current-handling capability or thermal safety margins.
The company says it has already begun supplying the new MOSFET to a global electric motor manufacturer.
Filed Under: Technology News