Parker Chomerics has introduced the CHO-THERM HV Series, a family of thermally conductive, electrically insulating interface pads designed for high-voltage electronic systems. The materials offer thermal conductivity values ranging from 1.1 to 3.3-W/m-K and dc breakdown voltages up to 20 kV.
The pads are designed to transfer heat from power-dense components such as CPUs, GPUs, and high-current busbars to cooling structures, including cold plates, heat sinks, cooling pipes, and vapor chambers.
The combination of thermal conductivity and electrical isolation makes the materials suitable for high-voltage environments, including electric vehicle (EV) power electronics, battery systems, onboard chargers, inverters, and dc fast-charging equipment.
The CHO-THERM HV Series features Shore 00 hardness values between 30 and 35 to support conformability across uneven or rough mating surfaces, helping reduce air gaps and thermal resistance. The materials are engineered for low compression force during installation and operation. Integrated dielectric layers provide electrical isolation between high-voltage components in automotive and industrial systems.
The materials are available in custom die-cut geometries or large-format sheets to accommodate a range of assembly processes and production volumes.
Features include:
- 1.1 to 3.3-W/m-K thermal conductivity
- Dc breakdown voltage up to 20 kV
- Ultra-low compression force
- High-tack surface to reduce thermal contact resistance
- Integrated dielectric layers for electrical isolation
- Vibration dampening
- PSA options for adhesion
- UL94 V-0 flammability rating
- RoHS compliant
Applications include
- Automotive power electronics
- EV battery systems and charging equipment
- High-voltage automotive sensors and actuators
- Lighting assemblies
-
Alternative energy power conversion and inversion equipment
Filed Under: Onboard Charging, Power Electronics, Technology News, Thermal Management