Henkel Adhesive Technologies has launched Bergquist Gap Filler TGF 6500LVO, a two-component thermal interface material for automotive electronics, including electric vehicle (EV) power conversion systems.
The silicone-based gap filler provides 6.5 W/m·K thermal conductivity and is designed to reduce thermal resistance between heat-generating components and adjacent cooling surfaces.
This is particularly relevant in EV power electronics, where increasing power density places greater demands on thermal management.
Bergquist Gap Filler TGF 6500LVO supports operating temperatures up to 150° C and is intended for applications that require low fogging and outgassing. Its low bond-line thickness also supports compact electronic assemblies where space is limited.
The material can be dispensed in automated production processes and cured at room temperature or with heat acceleration, supporting high-throughput automotive electronics manufacturing.
Bergquist Gap Filler TGF 6500LVO joins Henkel’s existing TGF 2100LVO, TGF 2900LVO, TGF 4400LVO, and TGF 10000 thermal gap fillers.
Filed Under: Adhesives, Technology News