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New thermal gap filler supports EV power electronics and ADAS

By Michelle Froese | July 7, 2025

Henkel has released a new addition to its thermal interface materials portfolio, designed to support the thermal and manufacturing demands of next-generation electric vehicle (EV) systems.

The Bergquist Gap Filler TGF 2100LVO, a two-component silicone-based material, is intended for use in EV electronic control units, advanced driver assistance systems (ADAS), and power conversion components such as on-board chargers (OBC), dc-dc converters, and inverters.

As power densities increase and packaging constraints tighten, EV platforms require thermal materials that ensure efficient heat transfer, regulatory compliance, and production flexibility.

The TGF 2100LVO addresses these requirements with a nominal thermal conductivity of 2.2 W/m·K, excellent wet-out properties, and a long working time of over 120 minutes to support automated, high-throughput assembly.

The formulation contains ultra-low volatile siloxane content and is free from D4, D5, and D6 siloxanes, reducing outgassing risk and aligning with evolving global REACH standards. These characteristics make it particularly suited for use in sealed electronic assemblies where material purity and long-term reliability are critical.

The product cures at room temperature in 24 hours and can be heat-accelerated where faster throughput is needed. Its robust flow properties and extended process window aim to reduce line-side material waste while maintaining consistent application in complex assemblies.

With growing demand for safe, reliable, and scalable thermal management solutions in EVs, Henkel’s development supports both the transition to electrified mobility and the ongoing evolution of automotive electronic architecture.

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Filed Under: Adhesives, Technology News
Tagged With: henkel
 

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