ENNOVI, a mobility electrification solutions partner, is successfully addressing the growing market demand for high-density interconnects in challenging automotive application scenarios.
The new ENNOVI-MB2B multi-row board-to-board (BTB) connector platform features a proprietary “snap-in biscuit” design, allowing multiple connector units to be stacked together without solder. This unique cost-effective approach enables different pin count requirements to be accommodated via the same basic interconnect platform without extra expense or engineering effort.
The design offers a customizable interface that gives engineers a scalable platform suitable for electric vehicle (EV) applications.
The new multi-row BTB connectors feature ENNOVI´s patented 0.4mm miniPLX press-fit terminals made from a copper alloy that exhibits low levels of contact resistance (<1mΩ). Each pin has a 3A current carrying capability. The optional coating of these pins with the company’s patented IndiCoat plating technology mitigates tin whisker build-up, preventing the risk of short circuits and extending operational lifespan.
ENNOVI-MB2B connectors are available in board stacking heights from 7 to 30mm. They can have between one and six rows, with up to 30 contact terminals incorporated into each row. Conforming with automotive performance requirements, these rugged products can withstand high humidity levels (eight-hour cycling up to 10% RH), mechanical shock (35g for 5 to 10ms across 10 axes) and vibration (eight hours per axis). A working temperature range of -40° to +150° C is supported.
“Being able to fit enough interconnect terminal pins into a small space, while not having any excess, is a priority for any of our clients. At the same time, keeping their total cost of ownership down is also vital,” explains Ralph Semmeling, product portfolio director with ENNOVI. “This means that the companies we are dealing with want access to off-the-shelf products at attractive price points, but with the inherent flexibility that following a custom-based strategy offers. Our new ENNOVI-MB2B stackable interconnect platform gives them the best of both worlds. Allowing them to design at cost.”
There are a broad variety of applications that the high-density, scalable multi-row BTB connectors will be targeted at. Among the most prominent of these are EVs — particularly for electric power steering (EPS) and electronic control unit (ECU) functions.
Filed Under: Technology News