ROHM has expanded its lineup of 40 and 60 V automotive-grade MOSFETs with the introduction of devices in a new HPLF5060 package (4.9 × 6.0mm).
The devices are intended for low-voltage automotive applications, including electric vehicle (EV) auxiliary systems such as inverter control circuits, electric pumps for thermal management, dc-dc conversion, and LED headlight modules.
The company also plans to begin mass production of MOSFETs in a DFN3333 (3.3 × 3.3mm) package incorporating wettable flank technology in February 2026. In addition, development is underway on a TOLG (TO-Leaded with Gull-wing) package (9.9 × 11.7mm) for higher-power automotive applications.
Automotive low-voltage MOSFET packaging continues to trend toward smaller form factors, including 5060-size and more compact options. However, reduced terminal spacing and leadless structures can introduce mounting reliability challenges.
The HPLF5060 package provides a smaller footprint than the commonly used TO-252 (6.6 × 10.0mm) while incorporating gull-wing leads to improve board-mount reliability. The package also uses copper clip interconnection technology to support higher current operation.
Mass production of MOSFETs using the HPLF5060 package began in November 2025. Devices are available through authorized distribution channels.
Filed Under: Power Electronics, Technology News