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New 100-V MOSFETs optimize power density for high-current EV applications

By Michelle Froese | October 24, 2025

Nexperia recently launched AEC-Q101-qualified 100-V MOSFETs in compact CCPAK1212 (12 x 12mm) copper-clip packaging. These devices deliver ultra-low conduction losses with on-resistance (RDS(on)) as low as 0.99 mΩ, and enable safe current above 460 A.

This makes them ideally suited for thermally demanding 48-V automotive applications, including onboard chargers (OBC), traction inverters, and battery management systems (BMS).

In addition to passenger vehicles, the new MOSFETs also benefit two and three-wheel e-mobility, dc-dc converters, and industrial high-current modules, where efficiency and thermal reliability are equally critical.

Automotive original equipment manufacturers (OEMs) are moving rapidly from 12 to 48-V subsystems to increase efficiency, reduce weight, and extend the driving range of electric vehicle (EV) platforms. In these high-power applications, minimizing conduction losses is critical.

To achieve this, designers typically connect several MOSFETs in parallel to meet performance needs, but this approach can increase component count and board space required. With their ultra-low RDS(on) and high power density, Nexperia’s CCPAK1212 MOSFETs reduce the need for parallel-connected devices, as well as saving up to 40% PCB space compared to traditional TOLL or TOLT-packaged alternatives due to their compact size.

The 100 V AEC-Q101 trench silicon platform, combined with the exceptional thermal performance (Rth(j-b) = 0.1 K/W) of Nexperia’s proprietary copper-clip CCPAK1212 package, enables the ultra-low RDS(on). Together, these features provide the critical advantages required in 48-V systems, including high current capability, power density, and a Safe Operating Area (SOA) rating of up to 400 A at 100 V.

To maximize design flexibility, the devices are available in a choice of inverted top-side cooled (CCPAK1212i) and bottom-side cooled (CCPAK1212) versions, giving engineers options for compact layouts and optimized thermal management tailored to their system requirements.

 

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Filed Under: Onboard Charging, Technology News
Tagged With: mosfet, onboardcharging, semiconductors
 

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