With power components evolving to meet higher efficiency demands and greater performance in power electronic systems, Microchip Technology announced its portfolio of IGBT 7 devices. They’re offered in different packages, multiple topologies, and current and voltage ranges to provide system designers with a range of power solutions.
Featuring increased power capability, lower power losses, and compact device sizes, this new portfolio is designed to meet high-growth market segments, including e-mobility. These high-performance IGBT 7 devices are essential building blocks for e-mobility, commercial and agricultural vehicles, and More Electric Aircraft (MEA) power applications.
Designers can select a suitable power solution based on their requirements. The IGBT 7 devices are offered in standard D3 and D4 62 mm and SP6C, SP1F, and SP6LI packages.
Many configurations are available in the following topologies: Three-level Neutral-Point Clamped (NPC), three-phase bridge, boost chopper, buck chopper, dual-common source, full-bridge, phase leg, single switch, and T-type. Devices are available with voltages ranging from 1200 to 1700V and current ranging from 50 to 900A.
The lower on-state IGBT voltage (Vce), improved antiparallel diode (lower Vf) and increased current capability can enable lower power losses, higher power density, and higher system efficiency. The lower-inductance packages, combined with the higher overload capability at Tvj −175° C, make these devices excellent options for creating rugged and high-reliability aviation and defense applications — such as propulsion, actuation and power distribution — at a lower system cost.
For motor control applications where enhanced controllability of dv/dt is important, the IGBT 7 devices are designed to offer freewheeling softness for efficient, smooth and optimized driving of switches. These high-performance devices also aim to improve system reliability, reduce EMI, and minimize voltage spikes.
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