imec recently announced that GlobalFoundries has joined its Automotive Chiplet Program (ACP) as a foundry partner. With additional participation from Infineon, Silicon Box, STATS ChipPAC, and TIER IV, the program brings semiconductor and automotive technology leaders to accelerate chiplet architectures for next-generation electric and software-defined vehicles.
As EVs evolve into high-performance compute platforms supporting ADAS, autonomous driving, and advanced infotainment, traditional monolithic chips face increasing limitations in cost, scalability, and thermal efficiency.
Chiplet-based architectures offer a modular alternative that can support higher processing density, heterogeneous integration, and improved reliability. These requirements are becoming standard across modern EV electronic systems.
imec’s ACP provides a pre-competitive research environment focused on developing chiplet architectures and packaging technologies that meet automotive-grade safety and reliability standards.
The initiative bridges semiconductor manufacturing, system integration, and automotive requirements to help speed adoption in future EV and autonomous platforms.
As a foundry partner, GlobalFoundries will contribute its manufacturing capabilities, process technologies, and global fab footprint across the US, Europe, and Asia to support the development of automotive-ready chiplet platforms within ACP.
Filed Under: Technology News