Wolfspeed, Inc., a US-based manufacturer specializing in silicon carbide (SiC) materials and devices, has announced the commercial release of its 200mm SiC bare wafers and epitaxy products, a key step for scaling electric vehicle (EV) power electronics and other high-efficiency systems.
The company had previously made 200mm SiC available to select customers, and is now expanding availability following positive feedback and demonstrated performance benefits.
The wafers feature improved parametric specifications at 350µm thickness, along with enhanced doping and thickness uniformity in the epitaxy process.
According to Wolfspeed, these advancements support higher MOSFET yields, faster time-to-market, and improved competitiveness in applications such as EVs (particularly in inverters, onboard chargers, and dc fast-charging systems), renewable energy, and industrial power systems.
“Wolfspeed’s 200mm SiC wafers are more than an expansion of wafer diameter – it represents a materials innovation that empowers our customers to accelerate their device roadmaps with confidence,” said Dr. Cengiz Balkas, chief business officer.
The company noted that learnings from 200mm development are also being applied to its 150mm SiC materials portfolio.
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